2UUL DA07 Mini Hot Press Station for Phone Frame/Back Cover Repair BGA Reballing Stencil JC P13 PCIE BGA110 Nand
Description
2UUL DA07 Mini Hot Press Station for Phone Frame Back Cover Repair BGA Reballing Stencil JC P13 PCIE BGA110 Nand JC P13 PCIE BGA110 Nand reading writing WIFI unbinding function for iPhone 8 13 Pro Max Both disassembly and welding are feasible at the same time
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy